Injection molding
The LDS material is used to inject the parts that will be directly structured by laser.
Laser activation
A special additive is added to the resin to have a laser-activating function. When laser engraving, a physicochemical reaction forms a metal core, which acts as a catalyst in copper plating.
The process of metallization is to clean the part first, followed by electroless copper plating, forming the copper layer with thickness of about 5-8 ¦Ìm, and finally nickel and gold are plated.
Assembly
Antennas, sensors, other electrical and electronic components
Series |
Grades |
Description |
PC/ABS |
Vismid??3200LDS |
Very good ?toughness?and?dimensional stability |
Vismid??3201LDS |
UL 94 V-1; very ? good toughness and dimensional stability |
|
PC |
Vismid??2100LDS |
Excellent ?toughness?and?dimensional stability |
Vismid??2102LDS |
UL 94 V-0; excellent toughness and dimensional ? stability |
|
Vismid??SOL 2100LDS |
Colorable, excellent toughness & dimensional stability |
|
Vismid??SOL ? 2102LDS |
Colorable, UL 94 ? V-0; excellent toughness and dimensional stability |
|
Vismid??SOL ? 2360LDS |
30% GF reinforced, colorable, high strength?and?stiffness, ? excellent dimensional stability |
|
PA10T |
Vismid??SOL 6360LDS |
30% GF reinforced, high strength,?superbly ? low water absorption,?high temperature resistance, suitable for SMT ? lead-free soldering |
Vismid??SOL 65250LDS |
35% GF/Mineral ?co-reinforced, superbly low water absorption, low warpage, high dimensional ? stability, high? temperature resistance, suitable for SMT lead-free ? soldering |
|
Vismid??SOL ? 6954LDS |
Thermally conductive; superbly low water absorption, ? low warpage, excellent dimensional stability, high heat resistance |
|
LCP |
Vismid??SOL 8365LDS |
30% GF ? reinforced, high temperature resistance, high flow, high dimensional ? stability, suitable for thin-wall and fast-cycle molding and SMT lead-free ? soldering process |
Vismid??SOL 8485LDS |
40% Mineral reinforced, high temperature resistance, ? high flow, low warpage, high dimensional stability, suitable for thin-wall ? and fast-cycle molding and SMT lead-free soldering process |
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